Scribing Lasers

Scribing is a process in which a line is “scratched” into a material, providing a controlled weak point to act as a guide for future mechanical breaking or ripping.  For example, this process is widely used in the semiconductor as a preparation step before cleaving; it is also used in the packaging of consumer goods to make it easier to open.   Scribing lasers are generally preferable to mechanical scribing techniques because they allow for high-speed non-contact scribing.  This is especially true for thin films and other packaging material where a mechanical scribe would likely cut too deep, whereas ultraviolet scribing lasers produce extremely shallow scribes.  On this page, you will find all scribing lasers including both passively q-switched microchip lasers and high power continuous wave fiber lasers.

To see a full list of other applications RPMC lasers are used for please check out our applications page by clicking here.