Thin Film Removal Lasers

Thin Film Removal Lasers Overview

Thin Film Removal

Laser thin film removal is the process of selectively ablating a very thin layer of material from a substrate, and is widely used on silicon, glass, ceramics, plastics, and metals. Thin-film removal lasers are generally short-pulsed with the ability to operate at high repetition rates to allow for sufficient pulse overlap at high processing speeds without damaging the substrate. Additionally, thin-film removal lasers must have very high beam quality and a high degree of accuracy.  The wavelengths of choice for these lasers are typically in the ultraviolet region in order to minimize depth penetration, but infrared lasers are still used in some cases.   On this page, you will find a list of all of the thin film removal lasers.

RPMC has years of experience supporting Thin Film Removal applications, helping industry professionals select the right tool for the job.

Contact Us today to let one of our knowledgeable Product Managers assist you!

Series

Diadem

 

DIADEM is a compact, air-cooled, high energy ultrafast laser for advanced micro-machining applications that require short femtosecond pulse widths. The Diadem is available with up to 40µJ of pulse energy, 30W of average power, and operation up to 1MHz (standard), with pulses below <400 fs and an M² < 1.2. This laser has been specifically designed for demanding medical implantable device and electronics manufacturing as well as high peak power optogenetics applications.

Sirius

 

SIRIUS is a very compact, high energy hybrid ultrafast laser for advanced micro-machining applications and supercontinuum pumping, offering over 120µJ and > 5 W, with pulses below 10 ps from single shot to 1MHz and an M² of < 1.2. This laser series specifically designed to allow for ergonomic and user-friendly operation. SIRIUS is ideally suited for selective ablation, electronics, and photonic applications.

 

Onda

 

Onda is a DPSS nanosecond OEM laser platform aimed at high-end applications requiring both excellent beam quality and high peak power in materials such as metals, glass, plastics, and various delicate and hard materials. Developed initially as a high-energy seeder for advanced MOPA laser systems, the Onda is now available as a standalone device operating at the wavelengths of 266, 355, 532 and 1064nm. The compactness and ease of use allow for superior operational flexibility and performance/cost ratio.

SOL

 

SOL Series is the most compact Q-switched Diode Pumped Solid State laser available in the power range from 6W to 40W @ 1064nm. Sol versions @ 532nn are also available with the same footprint. These air-cooled DPSS lasers are offered in a rugged and lightweight Single Unit, designed to allow easy and reliable integration in micro-machining and marking applications. Compactness, insensitivity to environmental conditions and ease of handling guarantee superior operation flexibility and performance/cost ratio.

Wedge

 

Wedge is a DPSS Laser that has been designed for OEM applications like micromachining of hard and soft materials, specialty marking, glass and crystals engraving, LIDAR, LIBS, Spectroscopy, and medical diagnostics. High peak powers, with relatively low energy and heat generation, allows efficient ablation and non-linear interaction with most materials. The compact and lightweight package represents a great benefit in LIDAR and other aerospace applications, while short pulses give extremely precise time-of-flight measurements. Second Harmonic (532 nm output) and wavelength conversion option widen the product application range.

JenLas Fiber ns

 

Jenlas Fiber ns series of nanosecond pulsed fiber lasers at 1085nm are available with up to 105W, 190 to 250 nanoseconds pulse widths, and peak pulse powers of up to 8 kilowatts. for precise material processing and cutting applications.

MicroMake

MicroMake Series is an integrated, compact, laser micromachining system for high precision and resolution applications such as ablation and cutting of programmable arbitrary shapes. This sub-nanosecond series is a flexible platform capable of >35kW of peak power and processing speeds up to 40mm/second. The system includes all the needed devices for direct laser micro-processing in a single monolithic air-cooled configuration. Live microscope imaging of the sample is offered during all process phases for alignment and immediate quality check. All these features perfectly suit a large variety of materials utilized in the fields of microelectronic circuits, displays fabrication and correction, biomedical device machining and optical substrates microprocessing.

OUR PRODUCTS

The search filters to the left can allow you to better sort through the Thin Film Removal Laser products offered at RPMC to find the one which is best suited for your application, or you can talk to one of our laser experts today by calling 1-636-272-7227.